PRODUCTS | Prepare the future of better technology
DIE BONDING TOOL
PRODUCTS | Prepare the future of better technology
DIE BONDING TOOL
STRENGTH
Ceramic material is a non-metallic solid of inorganic compound, and can work reliably in nonconductivity and resistance to electrical properties.
TECHNOLOGY
Vacuum hole processing can be applied to miniature chip pick up applications such as Mini Micro LED.
ADD. : 82, Jomaru-ro 411beon-gil 82, Wonmi-gu, Bucheon-si, Gyeonggi-do, Korea
TEL : +82-32-654-0355 | FAX : +82- 32-654-0357
ⓒ MSW SUNGJIN TECH. All rights reserved.
ADD. : 82, Jomaru-ro 411beon-gil 82, Wonmi-gu, Bucheon-si, Gyeonggi-do, Korea
TEL : +82-32-654-0355 | FAX : +82-32-654-0357
ⓒ MSW SUNGJIN TECH. All rights reserved.
