PRODUCTS | Prepare the future of better technology
DIE BONDING TOOL
PRODUCTS | Prepare the future of better technology
DIE BONDING TOOL
STRENGTH
The ejector pin is an auxiliary tool for chip pick up attached to the mounting tape and is applied to three kinds of products (general, thin film, small die) suitable for various applications.
TECHNOLOGY
- HISS
- Tungsten Carbide
- PLASTIC
Available in both standard and custom sizes. If your requirements differ from our standard sizes, customized production is also possible. With MSWKOREA technology, it is possible to customize the length tolerance of less than 5μm.
ADD. : 82, Jomaru-ro 411beon-gil 82, Wonmi-gu, Bucheon-si, Gyeonggi-do, Korea
TEL : +82-32-654-0355 | FAX : +82- 32-654-0357
ⓒ MSW SUNGJIN TECH. All rights reserved.
ADD. : 82, Jomaru-ro 411beon-gil 82, Wonmi-gu, Bucheon-si, Gyeonggi-do, Korea
TEL : +82-32-654-0355 | FAX : +82-32-654-0357
ⓒ MSW SUNGJIN TECH. All rights reserved.
