PRODUCTS | Prepare the future of better technology
DIE BONDING TOOL
PRODUCTS | Prepare the future of better technology
DIE BONDING TOOL
STRENGTH
Memory Semiconductor and Fingerprint Sensor Chip Pick up & Attach improves the void phenomenon. The combined role of back metal makes it easier to remove and attach the tool stably by magnetic force, and maintain flatness in the Attach process.
TECHNOLOGY
We are producing stable and high quality products with precise processing of Back Metal and Silicon Rubber with flatness of less than 50μm.
We have a variety of custom vacuum line designs ready to fit Various custom vacuum line designs are ready to fit per customer PKG or request.
ADD. : 82, Jomaru-ro 411beon-gil 82, Wonmi-gu, Bucheon-si, Gyeonggi-do, Korea
TEL : +82-32-654-0355 | FAX : +82- 32-654-0357
ⓒ MSW SUNGJIN TECH. All rights reserved.
ADD. : 82, Jomaru-ro 411beon-gil 82, Wonmi-gu, Bucheon-si, Gyeonggi-do, Korea
TEL : +82-32-654-0355 | FAX : +82-32-654-0357
ⓒ MSW SUNGJIN TECH. All rights reserved.
