PRODUCTS | Prepare the future of better technology
DIE BONDING TOOL
PRODUCTS | Prepare the future of better technology
DIE BONDING TOOL
STRENGTH
Epoxy adhesive liquid is dotted according to die size to enable stable and fast production speed.
TECHNOLOGY
- It is possible to process various special design shapes by our own precision processing technology, and it is also possible for short-term schedule according to customer’s production request.
- It has processing technology ability of 1pin ~ 24pin multi pin, so it can process ultrafine shape according to customer’s requirement.
ADD. : 82, Jomaru-ro 411beon-gil 82, Wonmi-gu, Bucheon-si, Gyeonggi-do, Korea
TEL : +82-32-654-0355 | FAX : +82- 32-654-0357
ⓒ MSW SUNGJIN TECH. All rights reserved.
ADD. : 82, Jomaru-ro 411beon-gil 82, Wonmi-gu, Bucheon-si, Gyeonggi-do, Korea
TEL : +82-32-654-0355 | FAX : +82-32-654-0357
ⓒ MSW SUNGJIN TECH. All rights reserved.
