PRODUCTS | Prepare the future of better technology
DISPENSING
PRODUCTS | Prepare the future of better technology
DISPENSING
ㆍ Description : Applied with Jet Dispensing fluid
glue(such as Epoxy, etc…) in LED hi-power-chip
Die-Bonding Process
ㆍ Application : Manual or Auto Dispenser
machines, such as Musashi, NEC, etc…
ㆍ Meterial : Nickel alloy
ㆍ Spectification : 1. Standard types, 2. Customer-
made for Customers’ needs.
ㆍ Description : Applied to Sealant Patterning glue
of LCD(Liquid Crystal Display) Cell Process
ㆍ Application : HITACHI Automatic Dispensing
Machine
ㆍ LCD Factory Generations : 3G, 4G, 5G, 6G, 7G
ㆍ Meterial : Nickel alloy
ㆍ Spectification : 1. Standard types, 2. Customer-
made for Customers’ needs.
ㆍ Description : Applied with Dispensing fluid
glue(such as Epoxy, etc …) in IC-package Die-
Bonding Process
ㆍ Application : Any brands of Auto Dispenser
machines
ㆍ Meterial : Nickel alloy
ㆍ Spectification : 1. Standard types, 2. Customer-
made for Customers’ needs.
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ADD. : 82, Jomaru-ro 411beon-gil 82, Wonmi-gu, Bucheon-si, Gyeonggi-do, Korea
TEL : +82-32-654-0355 | FAX : +82- 32-654-0357
ⓒ MSW SUNGJIN TECH. All rights reserved.
ADD. : 82, Jomaru-ro 411beon-gil 82, Wonmi-gu, Bucheon-si, Gyeonggi-do, Korea
TEL : +82-32-654-0355 | FAX : +82-32-654-0357
ⓒ MSW SUNGJIN TECH. All rights reserved.
